NEPCON ASIA 2026, Asia’s electronic production equipment exhibition, will be held from October 27 to 29, 2026, at Shenzhen World Exhibition & Convention Center.

Seprays / Genitec will showcase a range of PCB/PCBA depaneling machines and automation solutions at Booth 13F76, Hall 13.

At the booth, we will not only display standalone machines but also run a live demo of a complete line covering depaneling, tray loading, and AGV transport.

If you are interested in PCB depaneling, V-score depaneling, depaneling of PCBs with tall components, laser depaneling, or depaneling automation, you are welcome to visit us and discuss your needs.

Exhibition Information

• Exhibition: NEPCON ASIA 2026

• Date: October 27–29, 2026

• Venue: Shenzhen World Exhibition & Convention Center

• Hall: 13

• Seprays / Genitec Booth: 13F76

At the booth, you can see machine processing results, depaneling processes, and how the automated production line operates.

At this exhibition, Seprays / Genitec will highlight four types of equipment:

01 | 336AT + ZM600 + AGV
Integrated line demo: depaneling, tray loading, and transport

Live operation:
PCB depaneling → ZM600 tray loading → AGV automatic transport

This is not just a display of individual machines; the automation flow after depaneling will be running live.

It is ideal for customers interested in PCBA depaneling automation, loading/unloading, tray loading, transport, and line integration.

02 | GAM385AT
Inline PCB router with bottom-side cutting

For PCBs with tall components, where conventional top-side cutting may easily cause interference, GAM385AT uses bottom-side cutting for depaneling.

Key advantages:

• Depaneling PCBs with tall components

• Limited space between components and cutting path

• Inline production requirements

• PCB depaneling accuracy and stability

Bring your boards for an on-site test and see the actual depaneling result.

03 | ZM336AH
Inline V-score PCB saw depaneling machine

For V-scored PCB panels, ZM336AH uses a saw blade for depaneling.

Suitable for:
V-scored panels → inline depaneling → automated production

If your products mainly use V-score connections, come and learn about saw-blade depaneling and the machine configuration on site.

04 | ZAM330
Offline PCB/FPC laser depaneling machine

Laser depaneling is suitable for PCB/FPC products with high requirements for processing accuracy, cut quality, and dust control.

ZAM330 uses non-contact laser processing and is suitable for customers focused on:

• Precision PCB depaneling

• FPC depaneling

• Small boards and complex circuits

• High-precision processing

• Dust control

• 

Why see the machines in person?

PCB depaneling is not simply a matter of choosing a machine.

Different panel designs, board structures, component heights, and processing requirements call for different depaneling processes.

V-scored panels, mouse-bite panels, complex irregular boards, PCBs with tall components, and FPCs all require different equipment.

Watching machines run on site is more intuitive than reading specifications alone.

At the booth, Seprays / Genitec can discuss router, saw, laser, and automated depaneling solutions based on your PCB/FPC products and production requirements.

See you in Shenzhen, October 27–29

If you are currently sourcing:
PCB depaneling machines / PCBA depaneling machines / router depaneling machines / V-score depaneling machines / laser depaneling machines / depaneling automation equipment

Welcome to Booth 13F76, Hall 13, Shenzhen World Exhibition & Convention Center.

Bring your PCB/FPC products and discuss your processing solution with us on site.

Seprays / Genitec | Booth 13F76 — We look forward to meeting you.