Clean processing
Multi-function, automated
Dual platform, high speed, high precision
Easy and fast operation
ZAM330 Dual-Platform Offline Laser Depaneling Machine
The ZAM330 is a dual-platform offline laser depaneling machine designed for precision FPC/PCB processing. It delivers ±0.03 mm overall machine accuracy, a 350 × 400 mm cutting area, CCD automatic positioning, auto-focus, and a fume extraction system—making it ideal for high-precision, high-efficiency laser depaneling applications.
Key Features
1. Clear Laser Cutting Advantages
Non-contact processing: No mechanical stress or deformation, ideal for thin, brittle, and delicate materials.
Wide material adaptability: Can process complex geometries and is compatible with a variety of materials.
Environmentally friendly: Low dust, high efficiency, and energy-saving.
High precision: Narrow kerf and low heat-affected zone.
Kerf Width Comparison
| Processing Method | Kerf Width |
|---|---|
| Conventional mechanical methods | 0.5–1.0 mm |
| CO2/infrared laser | 80–120 μm |
| UV/green laser | <30 μm |
2. High-Performance Laser
Utilizes solid-state UV or green lasers from internationally leading brands. These lasers offer excellent beam quality, a small focused spot, uniform power distribution, low thermal effect, narrow kerf, and high cutting quality—ensuring perfect cutting results.
3. Fast Speed with High Precision
High-precision, low-drift galvanometer scanners are combined with a high-speed coreless linear motor platform, maintaining micron-level accuracy during high-speed cutting.
4. Fully Automatic Positioning
High-precision CCD automatic positioning and focusing provide fast, accurate alignment without manual intervention. Simple operation and one-touch modes for similar products greatly improve production efficiency.
5. Fume Extraction System
The extraction system completely removes cutting fumes, preventing harm to operators and pollution to the environment.
6. High Level of Automation
Automatic galvanometer calibration, auto-focus, and full-process automation. A laser displacement sensor automatically adjusts the focus height relative to the table for fast alignment, saving time and effort.
7. Easy-to-Learn Software
Proprietary Windows-based control software with an easy-to-use Chinese-language interface. It is friendly and attractive, powerful and versatile, and simple and convenient to operate.
8. Compatibility and Expandability
Compatible with picosecond/nanosecond lasers, selectable according to product requirements. Overall machine accuracy is ±0.03 mm, cut edges are free from carbonization, and the cutting area is 350 mm × 400 mm. The dual-platform automatic switching mode significantly improves production efficiency.
Applications and Cutting Examples
ZAM330 is widely used in precision FPC/PCB depaneling. Typical cutting examples include:
FPC depaneling
Fingerprint chips
Camera module depaneling
Rear fingerprint materials
Rigid-flex board depaneling & cover opening
FPC coverlay
High-gloss CD side-key fingerprint
Industries served include automotive electronics, mobile phones/ODM/EMS, new energy, notebooks & security, medical, storage, TWS/IoT, and other electronics manufacturing fields.
ZAM330 Frequently Asked Questions (FAQ)
Q1: What materials is ZAM330 suitable for cutting?
A: It is suitable for FR4, ferrite, FPC, ceramics (half-cut), and other materials. The laser power should be selected based on the product material and thickness.
Q2: What is the maximum cutting thickness of ZAM330?
A: Cutting thickness is ≤2.0 mm, depending on the material. For thicknesses above 2.0 mm, trial cutting is required with the appropriate laser power matched to the product material.
Q3: What is the accuracy of ZAM330?
A: Overall machine accuracy is ±30 μm (±0.03 mm), stage repeatability is ±3 μm, and X/Y-axis resolution is 1 μm.
Q4: What is the cutting area of ZAM330?
A: The cutting area is 350 × 400 mm. The dual-platform automatic switching mode can greatly improve production efficiency.
Q5: What laser does ZAM330 use?
A: Optional UV nanosecond/green nanosecond lasers. It is compatible with picosecond/nanosecond lasers and configured according to product requirements.
Q6: What software does ZAM330 use?
A: It uses SEPRAYS software developed in-house by Zhimao. It supports Gerber/DXF data formats and has a Windows 11 Chinese-language operator interface.
Q7: What after-sales service is available for ZAM330?
A: Services include 10-minute response, 24/7 remote support, 8-hour on-site arrival, issue resolution within 1 business day, lifetime maintenance, and more.
| Item | ZAM330 |
|---|---|
| Cutting Area | 350 × 400 mm (dual platform) |
| Machine Platform | Granite platform |
| Platform Operation Mode | Automatic dual-platform switching |
| Dust Extraction | Industrial dust extraction system (standard, 6P) |
| Cutting Thickness | ≤2.0 mm (depending on material); for thickness above 2.0 mm, trial cutting is required with suitable power matched to the material |
| Overall Machine Accuracy | ±30 μm (±0.03 mm) |
| Machine Repeatability | ±3 μm |
| X/Y Axis Resolution | 1 μm |
| Maximum Travel | X: 750 mm, Y: 700 mm, Z: 60 mm |
| Maximum Axis Speed | X: 2000 mm/sec, Y: 2000 mm/sec, Z: 300 mm/sec |
| Laser Service Life | 10,000–20,000 hours |
| Applicable Materials | FR4 / ferrite / FPC / ceramics (half-cut) |
| Positioning / Compensation | Automatic positioning, automatic expansion and contraction compensation |
| Cooling Method | Built-in water cooling |
| CCD Camera | 1.6 MP industrial camera |
| Ambient Temperature | 23°C ± 1°C |
| Ambient Humidity | 40%–60% |
| Safety Protection | Light curtain + safety door sensor |
| Power Requirement | 380 V, 50 Hz, 3.5 kW (voltage stabilizer optional for special voltages) |
| Air Supply Requirement | 0.5–0.7 MPa |
| Dimensions | 1364 × 1490 × 1614 mm (W × D × H, excluding tri-color signal light) |
| Weight | 1350 kg |





