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Seprays has been focusing on the research and development of laser PCB depaneling machines for more than 30 years, providing free depaneling solutions

Clean processing

Multi-function, automated

Dual platform, high speed, high precision

Easy and fast operation


+86-0769-82855018
Introduce

ZAM330 Dual-Platform Offline Laser Depaneling Machine

The ZAM330 is a dual-platform offline laser depaneling machine designed for precision FPC/PCB processing. It delivers ±0.03 mm overall machine accuracy, a 350 × 400 mm cutting area, CCD automatic positioning, auto-focus, and a fume extraction system—making it ideal for high-precision, high-efficiency laser depaneling applications.

Key Features

1. Clear Laser Cutting Advantages

  • Non-contact processing: No mechanical stress or deformation, ideal for thin, brittle, and delicate materials.

  • Wide material adaptability: Can process complex geometries and is compatible with a variety of materials.

  • Environmentally friendly: Low dust, high efficiency, and energy-saving.

  • High precision: Narrow kerf and low heat-affected zone.

Kerf Width Comparison

Processing MethodKerf Width
Conventional mechanical methods0.5–1.0 mm
CO2/infrared laser80–120 μm
UV/green laser<30 μm

2. High-Performance Laser
Utilizes solid-state UV or green lasers from internationally leading brands. These lasers offer excellent beam quality, a small focused spot, uniform power distribution, low thermal effect, narrow kerf, and high cutting quality—ensuring perfect cutting results.

3. Fast Speed with High Precision
High-precision, low-drift galvanometer scanners are combined with a high-speed coreless linear motor platform, maintaining micron-level accuracy during high-speed cutting.

4. Fully Automatic Positioning
High-precision CCD automatic positioning and focusing provide fast, accurate alignment without manual intervention. Simple operation and one-touch modes for similar products greatly improve production efficiency.

5. Fume Extraction System
The extraction system completely removes cutting fumes, preventing harm to operators and pollution to the environment.

6. High Level of Automation
Automatic galvanometer calibration, auto-focus, and full-process automation. A laser displacement sensor automatically adjusts the focus height relative to the table for fast alignment, saving time and effort.

7. Easy-to-Learn Software
Proprietary Windows-based control software with an easy-to-use Chinese-language interface. It is friendly and attractive, powerful and versatile, and simple and convenient to operate.

8. Compatibility and Expandability
Compatible with picosecond/nanosecond lasers, selectable according to product requirements. Overall machine accuracy is ±0.03 mm, cut edges are free from carbonization, and the cutting area is 350 mm × 400 mm. The dual-platform automatic switching mode significantly improves production efficiency.

Applications and Cutting Examples

ZAM330 is widely used in precision FPC/PCB depaneling. Typical cutting examples include:

  • FPC depaneling

  • Fingerprint chips

  • Camera module depaneling

  • Rear fingerprint materials

  • Rigid-flex board depaneling & cover opening

  • FPC coverlay

  • High-gloss CD side-key fingerprint

Industries served include automotive electronics, mobile phones/ODM/EMS, new energy, notebooks & security, medical, storage, TWS/IoT, and other electronics manufacturing fields.

ZAM330 Frequently Asked Questions (FAQ)

Q1: What materials is ZAM330 suitable for cutting?
A: It is suitable for FR4, ferrite, FPC, ceramics (half-cut), and other materials. The laser power should be selected based on the product material and thickness.

Q2: What is the maximum cutting thickness of ZAM330?
A: Cutting thickness is ≤2.0 mm, depending on the material. For thicknesses above 2.0 mm, trial cutting is required with the appropriate laser power matched to the product material.

Q3: What is the accuracy of ZAM330?
A: Overall machine accuracy is ±30 μm (±0.03 mm), stage repeatability is ±3 μm, and X/Y-axis resolution is 1 μm.

Q4: What is the cutting area of ZAM330?
A: The cutting area is 350 × 400 mm. The dual-platform automatic switching mode can greatly improve production efficiency.

Q5: What laser does ZAM330 use?
A: Optional UV nanosecond/green nanosecond lasers. It is compatible with picosecond/nanosecond lasers and configured according to product requirements.

Q6: What software does ZAM330 use?
A: It uses SEPRAYS software developed in-house by Zhimao. It supports Gerber/DXF data formats and has a Windows 11 Chinese-language operator interface.

Q7: What after-sales service is available for ZAM330?
A: Services include 10-minute response, 24/7 remote support, 8-hour on-site arrival, issue resolution within 1 business day, lifetime maintenance, and more.

Parameter
ItemZAM330
Cutting Area350 × 400 mm (dual platform)
Machine PlatformGranite platform
Platform Operation ModeAutomatic dual-platform switching
Dust ExtractionIndustrial dust extraction system (standard, 6P)
Cutting Thickness≤2.0 mm (depending on material); for thickness above 2.0 mm, trial cutting is required with suitable power matched to the material
Overall Machine Accuracy±30 μm (±0.03 mm)
Machine Repeatability±3 μm
X/Y Axis Resolution1 μm
Maximum TravelX: 750 mm, Y: 700 mm, Z: 60 mm
Maximum Axis SpeedX: 2000 mm/sec, Y: 2000 mm/sec, Z: 300 mm/sec
Laser Service Life10,000–20,000 hours
Applicable MaterialsFR4 / ferrite / FPC / ceramics (half-cut)
Positioning / CompensationAutomatic positioning, automatic expansion and contraction compensation
Cooling MethodBuilt-in water cooling
CCD Camera1.6 MP industrial camera
Ambient Temperature23°C ± 1°C
Ambient Humidity40%–60%
Safety ProtectionLight curtain + safety door sensor
Power Requirement380 V, 50 Hz, 3.5 kW (voltage stabilizer optional for special voltages)
Air Supply Requirement0.5–0.7 MPa
Dimensions1364 × 1490 × 1614 mm (W × D × H, excluding tri-color signal light)
Weight1350 kg


Case

激光分板案例用-英文.png

After Sales
Exclusive Services
Within 10 minutes, provide feedback to users regarding various difficult issues encountered while using the device, and establish a 1V1 exclusive after-sales service group for users.
Remote service
Provide users with a 7 * 24H hotline; Based on the feedback of the fault information, analyze and locate the fault through remote telephone support, remote login, and other methods, and solve it.
Field service
Arrive at the work site within 8 hours and solve the problem within 1 working day. 2-4 days of equipment safety operation and application training. In case of breach of contract, it shall be handled in accordance with the contract provisions.
Service Locations
We have sales and service support in 9 cities domestically and 28 countries and regions overseas, responding to customers' current and future needs in a timely manner.
Benchmark service
Follow up call for each attendance; Provide video tutorials and phone guidance for accessory replacement and equipment maintenance; Free follow-up month in December every year. Continuously collecting user suggestions, continuously updating and iterating software to improve user production quality and efficiency, and maintaining it for life.
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